Scientists from Tomsk Polytechnic University (TPU), together with colleagues from China, have developed a new method for creating copper composites that improves the reliability of computer chips, according to the press service of the Ministry of Education and Science of the Russian Federation.
Copper alloys are known for their thermal and electrical conductivity. This makes them ideal for use in electronics and heat dissipation systems.
To improve the mechanical properties of alloys, hard carbides are added to copper. However, existing methods for creating such composites have drawbacks that hinder their widespread use in industry.
The technology of the polytechnics allows controlling the shape, size and distribution of carbides inside copper. This improves the thermal conductivity and mechanical properties of the material.
The resulting metal matrix composites have improved characteristics compared to analogues and pure copper. Experts noted an increase in density, hardness and thermal conductivity.
The new materials are suitable for the production of radiators and bases for high-performance and miniature electronic devices. The use of such modern cooling systems will help prevent failures caused by overheating or mechanical deformation of equipment.
Earlier, www1.ru reported that polymer composites for operation at extreme temperatures were created in Tomsk.
Read also materials on the topic:
- Russian scientists have created a "sandwich" of graphene for new generation batteries
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