The testing of the first domestic mold compound, a material used for sealing and protecting microchips, has been completed at GS Nanotech. The development was carried out as part of a joint program of the National Research University of Electronic Technology (NIU MIET), JSC "Institute of Plastics", and other scientific organizations.
The compound successfully passed testing during the encapsulation of crystals in a PBGA196 package and confirmed compliance with technical requirements. Until now, Russian enterprises have mainly used Chinese analogues.
The presented material has significant potential to replace the currently used foreign analogue EMG-700-BS, the developers note.
Creating our own compound is a step towards reducing dependence on imports in the field of microelectronics. This is especially relevant against the background of limited access to foreign materials and the tasks of strengthening Russia's technological sovereignty.
Read materials on the topic:
"Tatneft" is developing the first Russian pumping unit for oil made of composites
