The Scientific Research Institute of Precision Mechanics (NIITM, part of Element Group) manufactured and delivered the "Episand TM" solid-source epitaxy unit to the customer. The unit's application area is the production of semiconductor devices – the basis for creating chips and power electronics.

The equipment is needed for growing epitaxial structures and is designed for depositing ultra-thick layers of polycrystalline silicon using the "sandwich" epitaxy method. The unit provides inductive RF heating up to 1300 degrees Celsius and is characterized by high productivity due to simultaneous processing of up to four 100 mm diameter wafers. The modernized two-position loading system is designed for two boats with graphite platforms.

As noted by the company, the development of its own epitaxy equipment is an important step towards the technological independence of Russian microelectronics. NIITM conducts developments within the framework of the comprehensive program "Development of Electronic Machine Building until 2030".

In conditions where similar equipment is produced by only a few countries in the world, and supplies to Russia are limited by sanctions, the creation of domestic units reduces dependence on foreign suppliers. Element Group intends to replace up to 70% of critically important equipment with its own developments, where the number of suppliers is limited to 1–2 manufacturers from unfriendly countries.