The Research Institute of Precision Engineering (NIITM) has created an installation for plasma-chemical vapor deposition (PECVD) on silicon wafers with a diameter of 300 mm. The new equipment will allow the creation of chips according to international standards.
Wafers with a diameter of 300 mm are the standard by which more than 90% of microcircuits in the world are currently produced. This size allows for the number of chips produced on one substrate. This reduces their cost for the end consumer.
The creation of a Russian PECVD installation is good news for the industry, as it is another step forward in real import substitution. We are talking about another cornerstone in the foundation of a full cycle of microelectronics production in our country.
According to Georgy Eritsyan, it was possible to localize the production of a significant number of components of the new equipment, and the basic technological processes are not inferior to foreign analogues. This also opens up the possibility for the country to become an alternative supplier of equipment for the production of microelectronics for interested states.
Earlier www1.ru reported that the "Angstrem" plant will establish the production of chips for consumer electronics.
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