Технологию вакуумного напыления для электроники усовершенствовали в НовГУ

Simple modification ensures uniform deposition of metal layers

Scientists at Yaroslav Mudry Novgorod State University have modernized a vacuum deposition system used for the production of micro- and nanoelectronics components. Previously, the equipment applied thin resistive and metallic layers unevenly, leading to defective products.

As part of the project, specialists created a special aperture with a hole that evenly distributes the material on the substrate and does not require disassembly of the system. The new approach proved to be cheaper than a complete replacement of the equipment — the modernization cost 15 million rubles instead of 50 million.

One of the authors of the project, Dmitry Kortsov, explained the principle of operation by analogy with a stencil for decorating a cupcake: the "cupcake" is the substrate of the product, the "powder with impurities" is the resistive material, and the "sieve" is the magnetron.

The development allows to improve the quality of products and save the plant's funds, while maintaining the integrity of the equipment. This is important for micro- and nanoelectronics enterprises, where the accuracy of layer deposition directly affects the reliability and functionality of finished products.

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Sources
TASS

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