In the next seven years, Russia intends to significantly strengthen its independence in the field of microelectronics, which is especially important in the face of global challenges. According to CNews, by 2030–2032, 122 Russian installations for the production of microchips will be delivered to domestic radio-electronic enterprises. This event is a key element of the electronic engineering development program developed by the Ministry of Industry and Trade in conjunction with the ISTC MIET.
Among the completed works, three development projects (R&D) stand out:
- «Progress PPI» — installation for projection transfer of an image onto a plate at the topology level up to 350 nm.
- «Progress KTF» — installation for controlling the topological pattern of photomasks.
By the end of 2025, it is planned to complete nine more installations, including equipment for molecular beam epitaxy and a plasma-chemical etching cluster. By 2030, the country plans to master the production of 313 chemicals, 250 materials and 216 computer-aided design (CAD) systems. Budget financing of the program until 2030 is planned at more than 240 billion rubles.
By 2030, it is planned to import-substitute about 70% of equipment and materials for the production of microelectronics, which will allow Russia to strengthen its position on the global technological stage. Currently, about 400 models of equipment for the production of microelectronics are used in the country, of which only 12% can be produced in Russia. The new program is designed to radically change this situation, providing domestic solutions for key stages of production, from crystal growth to lithography and quality control.
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