Geoscan Group has carried out a technical modernization of the printed circuit board production line. This is expected to improve product quality, minimize production errors, and increase output by 40%, according to Anton Kosov, Head of Production at Geoscan Group.
The SDM component mounting line (components designed for surface mounting on a board) was equipped with an automatic loading and unloading system for printed circuit boards, an 11-zone convection oven, and an intelligent printer for applying solder paste through a stencil.
At the first stage, the loader places the board in the printer, it is aligned with the stencil, and then solder paste is applied. In the second stage, the board is sent to the installer for mounting components and subsequent solder reflow in the oven.
The modernization allowed us to mount all the necessary types of boards, quickly reconfigure equipment between different products, and significantly increase the mounting speed. This is important in the context of growing demand and large-scale production of unmanned systems under the national civil order within the "UAS" national project.
The new equipment is planned to be used for creating prototypes and mass production.
Earlier, www1.ru reported that Roselectronics will produce up to 3000 m² of printed circuit boards per year in Omsk.
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