The Ministry of Industry and Trade of the Russian Federation has announced a tender for the development of a machine for cutting blanks from silicon wafers. The contract value is 300 million rubles, and applications are accepted until September 17.
The winner of the tender must create a prototype of equipment for the production of microchips. The deadline for fulfilling the terms of the tender is November 30, 2026.
The machine is expected to replace Swiss Meyer Burger, Chinese Linton Kayex, and American Diamond Wire Technologies. At the same time, there are no analogues of such equipment in Russia.
The machine ordered by the Ministry of Industry and Trade is intended for "cutting off cones and cutting blanks from silicon and germanium rods with a diameter of no more than 300 mm and blanks from synthetic sapphire, quartz, gallium arsenide, silicon carbide with a diameter of no more than 150 mm".
The department explained that the installation will be in demand by companies growing single-crystal ingots of silicon, germanium, sapphire, and quartz. These include NPO "Krit", "Lassard" and "Germanium".
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