8 Modules and 90 Nanometers: Russia Launches Its Equipment for Chips

Russian engineers have begun developing the first domestic cluster equipment for metal sputtering. NIITM and NIIME, which are part of the "Element" group, have taken on the project. The machine will receive 8 modules and will allow the production of microcircuits with a topology from 90 to 180 nanometers. The diameter of the wafers will be 200 millimeters. This is a serious step for the entire microelectronics industry of the country.

Funding comes through the Ministry of Industry and Trade under the program for the development of electronic mechanical engineering. The work will be completed by September 2030. All equipment is designed taking into account the possibility of future modernization.

The main feature of the system is the transport scheme. It includes two distribution units and a buffer chamber. The solution helps to maintain a deep vacuum and improves the quality of the films. Two robotic manipulators will work inside the complex to speed up processes. The modular assembly makes it possible to reconfigure the line for new tasks or change parts of the equipment without stopping the entire production. Spare modules will ensure operation even during repairs.

NIITM is responsible for drawings, layouts and tests of the structure. Colleagues from NIIME will form technical requirements and test the technology in practice. The head of NIIME, Alexander Kravtsov, expects that the finished installation will be of interest to factories not only inside the country, but also abroad. Experts are confident that the project will close important market needs.