Tramplin Electronics, NIU MIET, and AO ZNTC have signed an agreement on the joint development of packaging technologies for complex domestic microcircuits. One of the key areas will be the preparation for serial packaging of "Irtysh" processors in Russia.

This refers to BGA and LGA packages using flip-chip technology. These are all methods to "mount" a processor onto a motherboard. With BGA technology, the chip's contacts are arranged as an array of balls on its underside and are soldered to the board, while in the case of LGA, the chip is not soldered but pressed against the board's contacts using a special fastener. Additionally, the flip-chip method is used, where the die is mounted inverted, "face down," which shortens the signal path and improves heat dissipation.

The processor design includes several dies and over 10,000 leads, which significantly complicates assembly. Special lids with a metal thermal interface are used for heat dissipation.

Research and engineering work will be undertaken by the Advanced Packaging Technologies Laboratory of NIU MIET. Production is planned to be deployed at a new site of AO ZNTC. Specialists will have to develop technological routes, tooling, and methods for connecting dies to the package, as well as adapt the necessary materials for the Russian production base.

According to project participants, mass packaging of microcircuits of comparable complexity has not yet occurred in Russia. At the same time, domestic enterprises already possess individual competencies for assembling high-performance chips.

Tramplin Electronics intends to finance the development and launch of production through private investments. The company expects that the project will allow for increasing Russian competencies in packaging, creating new materials, and reducing the industry's dependence on foreign technologies.