The Zelenograd Nanotechnology Center is launching its own microchip packaging line in polymer housings in February 2026. The facility is designed to produce up to 100,000 chips per month, according to CNews.
The center will work with PBGA (wire bond) packages up to 1,000 contact pads, FC-BGA (flip-chip) up to 2,500, and HFCBGA with a heat spreader up to 8,000. The production is designed to handle 200 and 300 mm wafers.
For the new project, ZNTC has almost doubled its cleanroom space to 1,350 sq. m. Since 2021, the amount of equipment has increased to 161 units. The line is located in Zelenograd.
According to the center, test batches have already been carried out with microchips from "Angstrem", "MCST", "NM-Tech", "Milandr" and other Russian developers.
Alexey Borodastov, Development Director at GS Nanotech, explained that such packages are suitable for processors of various purposes, from consumer electronics to transport and aviation control systems.
At the same time, Russian companies currently occupy only about 6% of the packaging market, and most of the services are performed abroad.
Read materials on the topic:
Now on home
Applications are accepted until May 30, and the first finished batch is promised in the third quarter of 2026
Not only the volume increased, but also the quality of the products
The aircraft fell nose down, no fire was recorded on the ground
Vlad Shlepchenko: familiar tracking schemes no longer work
Popular AI services risk falling under new requirements
The service will for the first time broadcast a space launch from Baikonur live. The launch is scheduled for 14:00 on March 22.
Dmitry Yadrov called the project key for the aviation industry
SMZ demands 23.3 million rubles from UZGA
The compact gadget works even where the connection no longer reaches
New equipment is fully integrated into the vehicle for all-round defense
The system helps make decisions in everyday situations