The Zelenograd Nanotechnology Center is launching its own microchip packaging line in polymer housings in February 2026. The facility is designed to produce up to 100,000 chips per month, according to CNews.
The center will work with PBGA (wire bond) packages up to 1,000 contact pads, FC-BGA (flip-chip) up to 2,500, and HFCBGA with a heat spreader up to 8,000. The production is designed to handle 200 and 300 mm wafers.
For the new project, ZNTC has almost doubled its cleanroom space to 1,350 sq. m. Since 2021, the amount of equipment has increased to 161 units. The line is located in Zelenograd.
According to the center, test batches have already been carried out with microchips from "Angstrem", "MCST", "NM-Tech", "Milandr" and other Russian developers.
Alexey Borodastov, Development Director at GS Nanotech, explained that such packages are suitable for processors of various purposes, from consumer electronics to transport and aviation control systems.
At the same time, Russian companies currently occupy only about 6% of the packaging market, and most of the services are performed abroad.
Read materials on the topic:
- New step in the development of photonics: "Skoltech" created photonic chips for the first time in Russia
- Russia will entrust AI with the design of digital integrated circuits
- A method for reducing the size of microchips has been developed in Russia
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