С удвоенной теплопроводностью: в Москве разработали фотополимер для охлаждения микроэлектроники

The material includes boron nitride particles

The Skolkovo Institute of Science and Technology (Skoltech) has created a photopolymer with doubled thermal conductivity. The development is planned to be used in cooling systems for microchips and 3D printing of microcircuit housings, the university's press service reported.

In our case, the photopolymer must conduct heat well and not conduct electric current. We managed not only to increase, but to double its thermal conductivity, while the insulation properties and strength were not affected.
Daniil Chernodubov, Research Fellow at Skoltech

The new material features doubled thermal conductivity in a wide temperature range — from -270°C to +27°C. The photopolymer consists of 15-20% boron nitride particles. This approach has made it possible to improve the properties of the material.

It is expected that the development will allow creating microcircuit housings in the process of manufacturing microchips on a 3D printer. This will reduce the cost of electronics production.

Earlier, www1.ru reported that the largest military printed circuit board in Russia was manufactured in Yoshkar-Ola.

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