Moscow has launched Russia's first serial production of electrostatic chucks for handling wafers in the manufacturing of microcircuits, chips, and processors. The device is designed for use in vacuum processing equipment.
The main feature of the development is contactless wafer retention using an electrostatic field. This eliminates the need for mechanical clamping and reduces the risk of damage or contamination on sensitive surfaces.
The chucks will be used both as part of the manufacturer's own equipment and supplied separately for integration into existing technological lines across the country.
The project was implemented with the assistance of the Moscow Fund for Industrial and Entrepreneurship Support. Serial production is expected to expand local manufacturing of components for microelectronic equipment.
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