Russian manufacturer GS Nanotech has mastered microcircuit packaging at world standards. The company's specialists, together with the customer, have developed a unique substrate consisting of 26 layers.
Packaging microcircuits of this level became a challenge for the company, because no one before us had packaged microcircuits of this order. But thanks to our accumulated competencies, we successfully coped with this task.
An important part of the new technology is the use of the flip-chip method, which allows installing eight crystals in one package. In the assembly process, more than 200 SMD components were added, which are applied to the printed circuit board using surface mount technology. The results of the pilot batch were impressive: the yield of suitable products was 100%.
All stages of development and testing were carried out at the company's base in the city of Gusev in the Kaliningrad region. CEO Sergey Plastinin said that packaging microcircuits of this level was a real challenge, but thanks to the accumulated knowledge and experience, the team successfully coped with this task.
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