Russian developer and manufacturer of semiconductor products (from discrete transistors to modern microcontrollers) Angstrom plans to launch mass production of chips in plastic packages for consumer electronics in the coming years. This was announced by Inessa Frolova, head of the company's new product promotion group.
Angstrom is expected to reach a capacity of 50 million units per year by 2030, and also increase revenue to 5 billion rubles. According to Frolova, the company has already explored the possibility of producing such products. This will require state support to attract investment in the creation of an automated line.
Experts believe that it will be difficult for Angstrom to establish mass packaging of crystals in plastic due to its own financial problems.
Read more on the topic:
The first domestic UHF chip with a range of up to 14 meters was presented in Russia
Millions of Russian microcircuits and chips per year - Mikron launched new assembly lines