Russia plans to build three new production facilities at once, which should cover different stages of microelectronics production - from crystal manufacturing to assembly of finished components. The most complex project could be a factory for 300-mm silicon wafers, where 14 nm process technology is being considered as one of the options. According to CNews, pre-project work for it is planned to begin in 2027, and construction is to be completed by 2036.
This refers to projects within the framework of the newly created "Obedinennaya Mikroelektronnaya Kompaniya" (OMK). According to the strategy document, which was obtained by journalists, in addition to the crystal manufacturing factory, a module production enterprise and a separate OSAT factory for microelectronics packaging and testing are planned.
The module factory could be the first of the three sites to start operating. Construction is planned to begin in 2027 and be completed in the third or fourth quarter of 2028. Here, already finished electronic units will be assembled, such as power supplies, displays, navigation, and radio frequency modules.
Another project is an OSAT factory, which will deal with what happens to the microchip after the crystal itself is manufactured. It will be packaged, assembled, necessary elements connected, and the finished product tested. In addition, the enterprise plans to produce substrates used in the creation of packages and modules. Construction is expected to be completed in 2031.
The most complex project could be a factory for manufacturing crystals on 300-mm silicon wafers. In 2027, pre-project work and the development of the basic process technology are planned to begin. This will take about two years. The strategy lists 14 nm process technology among possible options. The completion of the enterprise's construction is planned by 2036.
A 300-mm factory is needed for manufacturing the crystals themselves. After this, the products go through the following stages - packaging, electrical connections, heat dissipation, and testing. In more complex products, several crystals can be combined with other components into one module. Thus, the three projects should cover different parts of the production chain.
At the same time, a separate project "NM-Tech" - "FAB-300" is already being developed in Zelenograd, designed, among other things, to master production according to 28 nm standards. CNews notes that work on this site and the new factory from the OMK strategy are separate projects and have different implementation timelines.
In total, according to the calculations presented in the strategy, 1.101 trillion rubles are planned to be allocated for the development of OMK until 2036
Of this amount, 1.031 trillion rubles should go directly to production, another 50 billion - to microelectronics design and engineering, and 20 billion - to the investment fund for promising technologies.
For 2027, the strategy provides for 170 billion rubles in investments, for 2028 - 161 billion, for 2029 - 196 billion, for 2030 - 101 billion. In 2031, another 69 billion rubles are planned, and in 2032–2036 - 262 billion.
Among the main difficulties of the project, CNews interlocutors name access to equipment, including lithographs. At the same time, for the production of microchips, equipment for controlling element sizes, etching and coating, as well as appropriate metrology, materials, chemical processes, and trained personnel are needed.
OMK is being created as a structure to consolidate key Russian assets in microelectronics. Its contour should include, in particular, "Element" and "NM-Tech". The managing legal entity of the project became OOO "Integralnye Skhemy".