Breakthrough in Microchip Design: ZNTC and "Progress" to Develop Chiplets on Silicon Interposer

New approach reduces production costs and accelerates time-to-market for products

Zelenograd Nanotechnology Center (ZNTC), in cooperation with NIIMA "Progress", is working on mastering chiplet technology. In the near future, a multi-chip assembly of five crystals connected on a single silicon interposer is planned for development, said ZNTC General Director Anatoly Kovalev.

Chiplets are a modular approach to microchip design, where a complex processor is assembled from several small crystals (chiplets), manufactured using different technological processes and combined in one package. This approach reduces production costs and accelerates the time-to-market for new products.

The development of chiplet technology is one of the stages in the development of ZNTC's assembly production. In January 2026, the company already commissioned a new assembly and testing complex with an area of 1200 square meters, which allows assembling up to 200 thousand microchips per month, including PBGA, FC-BGA, and HFCBGA package types. Modernization of production opens up the possibility for transitioning to multi-chip assembly and chiplets.

Read more on the topic: