In 2025, Russia plans to begin mass production of 56 types of chemical materials critical for semiconductor manufacturing. These include ultra-pure silicon-containing compounds, single-crystal germanium, gallium phosphide wafers, and other key components. This information was revealed in a presentation by the Ministry of Industry and Trade at the "Electronic Mechanical Engineering – 2025" conference.
In 2024, the production of seven chemical materials has already been established, and another 28 items are planned to be added by 2026. Thus, by the end of 2026, the Russian industry will be able to produce 91 types of specialized reagents for chip manufacturing.
The list of new materials will include:
- Ultra-pure silicon compounds (including silicon carbide and silicon oxide).
- Gallium phosphide wafers (used in LEDs and high-frequency electronics).
- Single-crystal germanium.
- Ceramic materials based on aluminum nitride (for microwave devices).
- Photomask blanks with chromium and iron coatings.
- Silicon carbide powders and granules.
- Ultra-pure molybdenum oxide.
- Silicon ingots doped with aluminum.
The composition of 48 chemical reagents has already been deciphered, and technical specifications for the development and production have been prepared for 31 items. 4.8 billion rubles have been allocated for the creation of domestic analogues of imported materials. Among the substances being mastered are fluoromethane, silicon tetrafluoride, hexamethyldisilazane, and other specialized compounds previously supplied from abroad.
The need for production localization arose after the introduction of sanctions, which limited the supply of finished electronics and raw materials for its manufacture. All work is scheduled to be completed by the end of 2026.
Earlier, www1.ru reported that Russian scientists started developing import-substituted ceramic sensors for microelectronics.
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